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hardware user manual cm - bf537 v3.x
cm - bf537_hum_v3.2.docx 1 contact bluetechnix mechatronische systeme gmbh waidhausenstr a?e 3/19 a - 1140 vienna austria/europe office@bluetechnix.at http://www.bluetechnix.com document no.: 100- 1221- 3 . 9 date: 2012- 05- 24
cm - bf537_hum_v3.2.docx 2 table of contents blackfin ? core modules ............................................................................................................................................................................ 5 blackfin ? development boards ............................................................................................................................................................. 7 1 introduction ....................................................................................................................................................................................... 8 1.1 overview .................................................................................................................................................................................... 8 1.2 key features ............................................................................................................................................................................. 9 1.3 applications .............................................................................................................................................................................. 9 2 general description ...................................................................................................................................................................... 10 2.1 functional description ....................................................................................................................................................... 10 2.2 boot mode ............................................................................................................................................................................... 10 2.3 memory map .......................................................................................................................................................................... 11 2.3.1 core module memory ............................................................................................................................................... 11 2.3.2 externally addressable memory (on connector) ............................................................................................ 12 3 specifications ................................................................................................................................................................................... 13 3.1 electrical specifications ...................................................................................................................................................... 13 3.1.1 operating conditions ............................................................................................................................................... 13 3.1.2 maximum ratings ....................................................................................................................................................... 13 3.1.3 esd sensitivity ............................................................................................................................................................. 14 4 connector description ................................................................................................................................................................. 15 4.1 conn ector x1 ......................................................................................................................................................................... 15 4.2 connector x2 ......................................................................................................................................................................... 16 5 application information .............................................................................................................................................................. 18 5.1 supply voltage decoupling ............................................................................................................................................. 18 5.2 reset circuit ............................................................................................................................................................................ 18 5.3 application example schematics ................................................................................................................................... 19 5.3.1 rj45 schematic ............................................................................................................................................................ 19 5.4 sample schematic ................................................................................................................................................................ 19 5.5 stand - alone ethernet based mpeg webcam ............................................................................................................. 20 6 mechanical outline ....................................................................................................................................................................... 22 6.1 top view .................................................................................................................................................................................. 22 6.2 bottom view ........................................................................................................................................................................... 22 6.3 side view ................................................................................................................................................................................. 23 6.4 footprint .................................................................................................................................................................................. 24 6.5 connectors .............................................................................................................................................................................. 24 7 support .............................................................................................................................................................................................. 25 7.1 general support .................................................................................................................................................................... 25
cm - bf537_hum_v3.2.docx 3 7.2 board support packages ................................................................................................................................................... 25 7.3 blackfin? software support .............................................................................................................................................. 25 7.3.1 blacksheep? os ........................................................................................................................................................ 25 7.3.2 labview ......................................................................................................................................................................... 25 7.3.3 uclinux ............................................................................................................................................................................ 25 7.4 blackfin ? design services ................................................................................................................................................... 25 7.4.1 upcoming products and software releases .................................................................................................... 25 8 ordering information ................................................................................................................................................................... 26 8.1 predefined mounting options for cm - bf537 ............................................................................................................ 26 9 dependability .................................................................................................................................................................................. 27 9.1 mtbf .......................................................................................................................................................................................... 27 10 product history .......................................................................................................................................................................... 28 10.1 version information ............................................................................................................................................................. 28 10.1.1 cm - bf537 - c - c - q25s32f4 (cm - bf537e) ............................................................................................................ 28 10.1.2 cm - bf537 - c - i - q25s32f4 (cm - bf537e - i) ........................................................................................................... 28 10.1.3 cm - bf537 - c - c - q25s64f4 (cm - bf537e - 64sd) ................................................................................................ 28 10.2 anomalies ................................................................................................................................................................................ 29 11 document revision history ................................................................................................................................................... 30 12 l ist of abbreviations ................................................................................................................................................................ 31 a list of figures and tables ............................................................................................................................................................ 32
cm - bf537_hum_v3.2.docx 4 ? bluetechnix mechatronische systeme gmbh 2012 all rights reserved. the information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. terms of delivery and rights of technical change reserved. we hereby disclaim any warranties, including but not limited to warranties of non - infringement, regarding circuits, descriptions and charts stated herein. bluetechnix makes and you receive no warranties or conditions, express, implied, statutory or in any communication with you. bluetechnix specifically disclaims any implied warranty of merchantability or fitn ess for a particular purpose. bluetechnix takes no liability for any damages and errors causing of the usage of this board. the user of this board is responsible by himself for the functionality of his application. he is allowed to use the board only if he has the qualification. more information is found in the general terms and conditions (agb). information for further information on technology, delivery terms and conditions and prices please contact bluetechnix (http://www.bluetechnix.com). warning due to technical requirements components may contain dangerous substances.
cm - bf537_hum_v3.2.docx 5 b lackfin ? core modules tcm - bf518 - c - c - q25s32f2 (tcm - bf518) the tiny core module t cm - bf518 is powered by analog devices' single core adsp - bf518 processor; up to 400mhz, 32mb sdram, up to 8mb flash. the 2x60 pin expansion connectors are backwards compatible with other core modules. acm - bf525c - c - c - q25s64f4n1024 the core module acm - bf525c is optimized for audio applications and performance. it is based on the high performance adspbf525cfrom analog devices. it addresses 64mbyte sdram via its 16bit wide sdram bus, has an onboard nor - flash of 4mbyte and a nand - flash with 1024mbyte. cm - bf527 - c - c - q50s32f8 (cm - bf527) the core module cm - bf527 is powered by analog devices' single core adsp - bf527 processor; key features are usb otg 2.0 and ethernet. the 2x60 pin expansion connectors are backwards compatible with other core modules. cm - bf533 - c - c - q25s32f2 (cm - bf533) the core module cm - bf533 is powered by analog devices' single core adsp - bf533 processor; up to 600mhz, 32mb sdram, 2mb flash, 2x60 pin expansion connectors a t a size of 36.5x31.5mm. tcm - bf537 - c - i - q25s32f8 (tcm - bf537) the tiny core module tcm - bf537 is powered by analog devices' single core adsp - bf537 processor; up to 500mhz, 32mb sdram, 8mb flash, a size of 28x28mm, 2x60 pin expansion connectors, ball grid array or border pads for r eflow soldering, industrial temperature range - 40c to +85c. cm - bf537 - c - c - q25s32f4 (cm - bf537e) the core module cm - bf537 is powered by analog devices' single core adsp - bf537 processor; up to 600mhz, 3 2mb sdram, 4mb flash, integrated tp10/100 ethernet physical transceiver, 2x60 pin expansion connectors a t a size of 36.5x31.5mm. cm - bf537 - c - c - q30s32f4 - u (cm - bf537u) the core module cm - bf537 is powered by analog devices' single core adsp - bf537 processor; up to 600mhz, 32mb sdram, 4mb flash, integrated usb 2.0 device, 2x60 pin expansion connectors at a size of 36.5x31.5mm. cm - bf548 - c - c - q25s64f8 (cm - b f548) the core module cm - bf548 is characterized by its numerous peripheral interfaces, its performance in combination with its high speed memory interface (ddr) . k ey features are 533 mhz , 64mb ddr sd - ram (266mhz), and 8mb flash. cm - bf561 - c - c - q25s64f8 (cm - bf561) the core module cm - bf561 is powered by analog devices' dual core adsp - bf561 processor; up to 2x 600mhz, 64mb sdram, 8mb flash , 2x60 pin expansion connectors at a size of 36.5x31.5mm. ecm - bf561 - c - c - q25s128f32 (ecm - bf561) the core module cm - bf561 is powered by analog devices' dual core adsp - bf561 processor; up to 2x 600mhz, 128 mb sdram, 8mb flash, 2x 100 pin expansion co nnectors and a size of 44 x3 3 mm.
cm - bf537_hum_v3.2.docx 6 core module naming information the idea is to put more core module specific technical information into the product name. new core module names w ill have following technical information covered in their names. ? product family, ? cpu - type, ? connection - type, ? operating temperature range, ? crystal frequency [mhz], ? ram [mb], ? flash [mb], ? external controllers ? o special and/or o former name that expands of course the name but allows the customer to get the most important core module specific information at the first sight. have a look at the example below to get an idea of the new core module names. example cm - bf537 - c - c - q25s32f4 (cm - bf537e) - - - - - - product family former name cm = core modul e special sbc = single board computer custom core modules or specials cpu-type uc = uclinux equals the name of cpu extra controllers mounted connection-type e = ethernet a = bga u = usb b = border pad flash [mb] c = connector f = nor flash [mb] s = s speci al n = nand fl as h [mb] operating temperature range ram a = automoti ve (-40 to +125) s = sdram [mb] c = commerci al (0 to +70) i = industry (-40 to +85) crystal frequency notati on: qxx[mhz] f4 (CM-BF537e) s32 cm bf537 c c q25
cm - bf537_hum_v3.2.docx 7 b lackfin ? development boards adev - bf52xc f eature rich, low cost embedded audio development platform which supports audio core modules (acm). the form factor of the adev - bf5 2 x c allows easy integration of the board into oem products. dedicated interfaces such as usb2.0, line in/out, headphone out and an onboard silicon microphone turn the adev - bf52xc into a full - featured development platform for most embedded audio applications in commercial areas. dev - bf5xxda - lite get ready to program and debug bluetechnix core module s with this tiny development platform including an usb - based debug agent. the dev - bf5xxda - lite is a low cost starter development system including a vdsp++ evaluation software license. dev - bf548 - l ite low - cost development board with a socket for bluetechnix cm - bf548 core module. additional interfaces are available, e.g. an sd - card, usb and ethernet. dev - bf548da - lite get ready to program and debug bluetechnix cm - bf548 core module with this tiny development platform including an usb - based debug agent. the dev - bf548da - lite is a low - cost starter development system including a vdsp++ evaluation software license. edev - bf5xx f eature rich, low cost rapid development platform which provides all interfaces on dedicated connectors and has all core module pins routed to solder pads which easily can be accessed by the developers. the edev - bf5xx supports the latest debugging interface from analog devices - adi - sada (analog devices stand alone debug agent) . eval - bf5xx tiny, low cost embedded platform which supports bluetechnix powerful blackfin? based core modules. the form factor (75x75mm) of the eval - bf5xx allows easy integration of the board into oem products. dedicated interfaces such as usb2.0, sd - card slot, can interface connectors and of course ethernet, turn the eval - bf5xx into a full - featured evaluation platform for most embedded applications. extender boards e xtender b oards (ext - bf5xx) are expanding the development and evaluation boards by several interfaces and function alities. targeted application areas are: audio/video processing, security and surveillance, ethernet access, positioning, automation and control, experimental development and measuring. note! bluetechnix is offering tailored board developments as well.
cm - bf537_hum_v3.2.docx 8 1 introduction the core - module cm - bf5 37 is characterized by its field of application, performance and configuration possibility. the module integrates processor, ram, flash, external peripheral controllers and power supply at a size of 31.5x36.5mm ! it is based at the high performance adsp - bf5 37 from analog devices . the core - module is designed for commercial and industrial usage (depending on t emperature range). it addresses up to 64mbyte sdram via its 16bit wide sdram bus, has an onboard nor - flash of 4mbyte and offers a can interface. in addition there is an extra ethernet physical transceiver (10/100mbit) onboard. 1.1 overview the current hardware version (see version information ) of core module c m - bf537 - c - c - q25s32f4 (cm - bf537e ) consi sts of the following components . parts of mounting options of cm - bf537 are lis ted in addition. up to 64mbyte sdram 60 pin expansion connector a up to 8mbyte flash adsp bf537 up to 600 mhz dynamic core voltage control 60 pin expansion connector b low voltage reset ethernet physical figure 1 - 1 : main components of the cm - bf537 core module ? analog devices blackfin processor bf537 o industrial version 8.1 (see chapter ) ? adsp - bf537sbbcz - 5a ( - 40 - 85c) o commercial version 8.1 (see chapter ) ? adsp - bf537skb cz - 6a v (0 - 70c) ? sdram o 32mbyte sdram 8.1 version (see chapter ) ? sdram clock up to 133m hz ? mt48lc16m16a2bg - 7 (16mx16, 256mbit at 3.3 v) o 64mbyte sdram 8.1 version (see chapter ) ? sdram clock up to 1 43 mhz ? is42s16320b - 7bl ( 8m x16x4 , 512 mbit at 3.3 v) ? 4 mb yte of addressable flash o pf48f2000p0zbq0 (4mx16 32mbit at 3.3 v; default only 4 mbyte addressable)
cm - bf537_hum_v3.2.docx 9 o additional flash memory can be connected through the expansion board as parallel flash using asynchronous chip select lines or as an spi flash. ? ethernet physical transceiver o micrel ksz8041nli ? low voltage reset circuit o resets module if power supply goes below 2.93 v for at least 140 ms ? dynamic core voltage control o core voltage is adjustable by setting software registers on the blackfin processor o core voltage range: 0.8 C 1.32v ? expansion connector a o data bus o address bus o control signals o power supply o ethernet pins ? expansion connector b o spo rt0 o jtag o uart0/uart1 o can o twi (i 2 c compatible) o spi o ppi (parallel port interface) o gpios 1.2 key features ? the cm - bf537 is very compact and measures only 36.5x31.5mm ? allows quick prototyping of product that comes very close to the final design ? reduces development costs, faster time to market ? very cost effective for small and medium volumes 1.3 applications ? robotics ? video security ? video surveillance ? industrial distributed control ? industrial factory automation ? remote monitoring devices ? point - of - sale terminals ? voip ? biometrics/security ? instrumentation ? medical appliances ? consumer appliances
cm - bf537_hum_v3.2.docx 10 2 general description 2.1 functional descriptio n up to 64mbyte sdram 4mbyte flash adsp bf537 up to 600mhz dynamic core voltage control low voltage reset 20 bit address bus 16 bit data bus ethernet physical clock mem. control, boot mode, jtag, ethernet data & address bus clock-out ppi, sport0, uart1, uart2, spi, twi, can, gpio 3v3 power , reset figure 2 - 1 : detailed b lock d iagram figure 2 - 1 shows a detaile d block diagram of the cm - bf537 . other than the sdram control pins the cm - bf537 has all other pins of the blackfin processor on its two main 60 pin connectors. a special feature of the core module cm - bf537 is the on - board physical ethernet transceiver from micrel ( ksz8041nli ). dynamic voltage control allows reducing power consumption to a minimum adjusting the core voltage and the clock frequency dynamically in accordance to the required processing power. a low voltage reset circuit guarantees a power on reset and resets the system when the input voltage drops below 2.93v. 2.2 boot mode by default the boot mode = 000 (bmode2 = low, bmode1 = low, bmode0 = low). all bmode pins have internal pul l down resistors. connect bmode0 to vcc and leave bmode1, bmode2 pins open for boot mode 001 equals to 8 or 16 bit prom/flash boot mode, this is the default boot mode of blacksheep? os . see blackfin datasheets or eval/devboard manuals for more details.
cm - bf537_hum_v3.2.docx 11 2.3 memory map 2.3.1 core module memory memory type start address end address size comment flash bank0 (pf4 flag low) 0x20000000 0x201fffff 2mb 1/8 of 16 mb micron flash, pf48f3 000p0zbq flash bank1 (pf4 flag high) 0x20000000 0x201fffff 2mb 1/8 of 16 mb micron flash, pf48f3 000p0zbq flash bank2 (pf5 flag low) * 0x20000000 0x201fffff 2mb 1/8 of 16 mb micron flash, pf48f3 000p0zbq flash bank 3 (pf5 flag high) * 0x20000000 0x201fffff 2mb 1/8 of 16 mb micron flash, pf48f3 000p0zbq sd - ram 32 0x00000000 0x01ffffff 32mb 16bit bus, micron mt48lc16m16a2fg sd - ram 64 0x00000000 0x 1fffffff 64mb 16bit bus, issi is42s16320b - 7bl table 2 - 1 : memory m ap the maximum amount of addressable memory by a single asynchronous memory bank i s 2mb yte . in order to be able to use more than 2mb yte on a single bank 2 gpios are used to select which 2mb section of flash is active in the memory window of the blackfin processor. this frees up the remaining banks for the user. the maximum amount of memory addressable by the processor is 8mb yte . *) pf5 is routed by default to the connector of the c ore m odule. nevertheless this pin can be used to select bank2/3 of the flash memory. to realize this , the 0 ? resistor r18 must be removed and a 0 ? resistor r19 must be soldered to the c ore m odule. in this case pf5 is routed to the flash memory instead to the connector! figure 2 - 2 : assembly drawing top view
cm - bf537_hum_v3.2.docx 12 2.3.2 externally addressable memory (on connector) the blackfins external bus interface (ebi) allows connecting devices via an asynchronous memory interface. ams line start address end address max. size nams2 0x202 00000 0x202 fffff 1 mb nams3 0x203 00000 0x203 fffff 1mb table 2 - 2 : externally addressable memory
cm - bf537_hum_v3.2.docx 13 3 specification s 3.1 electrical specification s 3.1.1 o perating conditions symbol parameter min typical max unit v in input supply voltage 3.0 3.3 3.6 v i 3v3 3) 3.3v current - 350 - ma v oh high level output voltage 2.8 - - v v ol low level output voltage - - 0.5 v i ih io input current - - 10 a i oz three state leakage current - - 10 a i deepsleep v in current in deep sleep mode - 16 - ma i sleep v in current in sleep mode - 19.5 - ma i idle v in current in idle mode - 24 - ma i typ v in current in with core running at 400 mhz - 138 - ma i hibernate 1 ) v in current in hibernate state at 400 mhz - - 70 ma i rtc v rtc current - 20 - a f cclk 2) core clock frequency - - 600 mhz table 3 - 1 : electrical c haracteristics 1) v ddint =1.10v @ t j =25c 2) co mmercial g rade 3) average load @ 25c ambient temperature 3.1.2 maximum ratings stressing the device above the rating listed in the absolute maximum ratings table may cause permanent damage to the device. these are stress ratings only. operation of the device at these or any other conditions greater than those indicated in the operating sections of this specification is not implied. exposure to absolute maximum rating conditi ons for extended periods may affect device reliability. symbol parameter min max unit v io input or output voltage - 0.5 3.6 v v in input supply voltage 3.0 5.5 v i oh /i ol current per pin 0 1 0 ma t amb ambient temperature - 40 85 c t sto storage temperature - 55 150 c t sld solder temperature for 10 seconds 260 c amb relative ambient humidity 90 % table 3 - 2 : absolute m aximum r atings
cm - bf537_hum_v3.2.docx 14 3.1.3 esd sensitivity esd ( e lectro s tatic d ischarge) sensitive device. charged devices and circuit boards can discharge without detection. although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy esd. therefore, proper esd pre cautions should be taken to avoid performance degradation or loss of functionality.
cm - bf537_hum_v3.2.docx 15 4 connector description 4.1 connector x1 pin no. signal name type function 1 rsclk0 / taclk2 i/o 2 dr0pri / taclk4 i 3 tsclk0 / taclk1 i/o 4 dt0pri / ssel2 o 5 clkbuf o 25mhz buffered clock output 6 sda i/o 7 pf4 / tmr5 / ssel6: mo1* nc: mo2, mo3* i/o 8 pf5 / tmr4 / ssel5: mo1, mo2* nc: mo3* i/o 9 vin 3v3 pwr 3v3 + - 10% 500ma peak for supply 10 vin 3v3 pwr 3v3 + - 10% 500ma peak for supply 11 pg0 / ppi1d0 i/o 12 pg2 / ppi1d2 i/o 13 pg4 / ppi1d4 i/o 14 pg6 / ppi1d6 i/o 15 pg8 / ppi1d8 / dr1sec i/o 16 pg10 / ppi1d10 / rsclk1 i/o 17 pg12 / ppi1d12 / dr1pri i/o 18 pg14 / ppi1d14 / tfs1 i/o 19 ppi1sy3 / pf7 / tmr2 i/o 20 ppi1sy1 / pf9 / tmr0 i/o 21 ppi1sy1 / pf9 / tmr0 i/o 22 pf3 / rx1 / tmr6 / taci6 i/o 23 pf1 / dmar1 / taci1 / rx0 i/o 24 pf11 / mosi i/o 25 pf13 / sck i/o 26 bmode0 i - 10k pull down 27 gnd pwr 28 tck i - 10k pull up 29 tdi i - 10k pull up 30 trst i - 4k7 pull down 31 emu o 32 tms i - 10k pull up 33 tdo o 34 bmode2 i - 10k pull down 35 n.c. - nc 36 bmode1 i - 10k pull down 37 pf12 / miso i/o 38 pf0 / dmar0 / tx0 i/o 39 pf14 / spi_ss i/o 40 pf2 / tx1 / tmr7 i/o 41 ppi1clk / pf15 / tmrclk i/o 42 ppi1sy2 / pf8 / tmr1 i/o 43 pg15 / ppi1d15 / dt1pri i/o 44 pg13 / ppi1d13 / tsclk1 i/o 45 pg11 / ppi1d11 / rfs1 i/o
cm - bf537_hum_v3.2.docx 16 pin no. signal name type function 46 pg9 / ppi1d9 / dt1sec i/o 47 pg7 / ppi1d7 i/o 48 pg5 / ppi1d5 i/o 49 pg3 / ppi1d3 i/o 50 pg1 / ppi1d1 i/o 51 gnd pwr 52 gnd pwr 53 pf5 / tmr4 / ssel5: mo1, mo2* nc: mo3* i/o 54 pf6 / tmr3 / ssel4 i/o 55 pf10 / ssel1 i/o 56 scl i/o 57 dt0sec / ssel7 / cantx o 58 tfs0 / ssel3 i/o 59 dr0sec / taci0 / i 60 rfs0 / taclk3 i/o table 4 - 1 : connector d escription x1 * for mount option details see chapter 8.1 . note 1: pin 8 and 53 as well as pin 20 and 21 are identical. note 2: please mind the mounted pull up and pull down resistors on the core module. 4.2 connector x2 pin no. signal name type function 61 a1 o address bus 62 a3 o address bus 63 a5 o address bus 64 a7 o address bus 65 a9 o address bus 66 a11 o address bus 67 a13 o address bus 68 a15 o address bus 69 a17 o address bus 70 a19 o address bus 71 abe1 /sdqm 1 o 72 led_act o indicates ethernet activity 73 gnd - agnd use as gnd for ethernet 74 rx+ i C 4 7r pull up to 3 v 3 ethernet receive + 75 rx - i C 4 7r pull up to 3 v 3 ethernet receive - 76 adry i - 10k pull up 77 bg o 78 clk _out o clkout pin of blackfin 79 gnd pwr 80 ams3 o 81 aw e o 82 nmi i - 10k pull up 83 d0 i/o data bus 84 d2 i/o data bus 85 d4 i/o data bus
cm - bf537_hum_v3.2.docx 17 pin no. signal name type function 86 d6 i/o data bus 87 d8 i/o data bus 88 d10 i/o data bus 89 d12 i/o data bus 90 d14 i/o data bus 91 d15 i/o data bus 92 d13 i/o data bus 93 d11 i/o data bus 94 d9 i/o data bus 95 d7 i/o data bus 96 d5 i/o data bus 97 d3 i/o data bus 98 d1 i/o data bus 99 reset i C see chapter 5.2 100 aoe o 101 are o 102 ams2 o 103 vdd - rtc pwr 104 bgh o 105 br i - 10k pull up 106 va33 pwr ethernet transformer voltage reference 107 tx - o - 4 7r pull up to 3 v 3 ethernet transmit - 108 tx+ o - 4 7r pull up to 3 v 3 ethernet transmit + 109 nc 110 led_speed o full duplex led, high = full duplex active, low = inactive 111 abe0 /sdqm0 o 112 a18 o address bus 113 a16 o address bus 114 a14 o address bus 115 a12 o address bus 116 a10 o address bus 117 a8 o address bus 118 a6 o address bus 119 a4 o address bus 120 a2 o address bus table 4 - 2 : connector d escription x2 note: please mind the mounted pull up and pull down resistors on the core module.
cm - bf537_hum_v3.2.docx 18 5 application information 5.1 supply voltage decoupling for a better stability we recommend to add a 1 00 nf capacitor for each power supply pin and a 47uf tantalum capacitor to the v in voltage rail next to the module. 5.2 reset circuit the reset of the flash and the processor are connected to a power monitoring ic. the output can be used as power on reset for external devices, see figure 5 - 1 . figure 5 - 1 : schematic of reset circuit on the core module
cm - bf537_hum_v3.2.docx 19 5.3 application example schematics 5.3.1 rj45 schematic figure 5 - 2 : schematic for rj45 connection designator value type description quantity x1 rjlbc - 060tc1 rj45 with transformer 1:1 1 c1 10uf capacitor 1 r8, r9 220r resistor 2 v1, v2 usblc6 - 2p6 tsv - diode 2 table 5 - 1 : parts list rj45 5.4 sample schematic in this minimum configuration the cm - bf537 is used as a high performance network connected processor module.
cm - bf537_hum_v3.2.docx 20 figure 5 - 3 : configuration with ethernet and jtag connector designator value type descri ption quantity c1, c2, c4 1uf capacitor 3 c3, c5 10uf capacitor 1 cm1 cm - bf537 1 x1 dc - 8 power connector dc - 8 1 x2 rjlbc - 060tc1 rj45 with transformer 1 x3 header, 7 - pin, dual row 1 r3 4k7 resistor 1 r8, r9 220r resistor 2 s1 switch 1 u1 adp3338 low dropout regulator 1 table 5 - 2 : bill of material of s ample c ircuit 5.5 stand - alone ethernet based mpeg w ebcam the cm - bf537 module can be used as a stand - alone module for a camera system requiring only power supply and the direct attachment of a compatible video camera. an extender board including a camera is available at bluetechnix ( ext - bf5xx - c am ).
cm - bf537_hum_v3.2.docx 21 figure 5 - 4 : stand - alone ethernet based mpeg w ebcam designator value type description quantity c3, c4, c5, c6, c8 1uf capacitor 6 c7, c9 10uf capacitor 1 cam1 ov7660fsx camera module 1 cm1 cm - bf537 1 ds1 green smd led 1 x1 dc - 8 power connector dc - 8 1 x2 hfj11 - 2250e rj45 with transformer 1 r1,r3 10k resistor 3 r7, r8, r9 220r resistor 2 s1, s2 switch 1 u1 adp3338 low dropout regulator 1 u2 xc6204b252mr xc6204 high speed ldo 1 u3 xc6204b182mr xc6204 high speed ldo 1 table 5 - 3 : bill of materials of a stand - alone ethernet based mpeg webcam have a look at our dev - bf5xx da - lite schematics, which can be found at http://www.bluetechnix.com/goto/dev - bf5xxda - lite to get application examples.
cm - bf537_hum_v3.2.docx 22 6 mechanical outline 6.1 top view figure 6 - 1 shows the bottom view of the cm - bf537. all dimensions are given in millimeters. figure 6 - 1 : mechanical outline (top view) 6.2 bottom view figure 6 - 2 shows the bottom view of the cm - bf537. all dimensions are given in millimeters.
cm - bf537_hum_v3.2.docx 23 figure 6 - 2 : mechanical ou tline and bottom connectors (top view) 6.3 side view figure 6 - 3 shows the side view of the cm - bf537. all dimensions are given in millimeters. 36.0 1.1 2.0 2.45 31.0 5.7 5.7 24.5 figure 6 - 3 : side view with mounted connectors the total minimum mounting height including receptac le at the motherboard is 6.1mm.
cm - bf537_hum_v3.2.docx 24 6.4 footprint figure 6 - 4 : recomm ended footprint for the core module (top view) the footprint of the cm - bf537 is available on request. the used connectors can be found in table 6 - 1 . for detailed dimensions of the connectors please see the datasheet from the manufacturers website. 6.5 connectors the core module features a hirose 0.6mm pitch connectors. the base board has to use the complementary connector. board designator manufacturer manufacturer part no. core module x1, x2 hirose fx8 - 60p - sv b ase board x 1, x2 hirose fx8 - 60s - sv table 6 - 1 : core module c onnector t ypes hole1 hole2 hole1 hole2 h2 h1
cm - bf537_hum_v3.2.docx 25 7 support 7.1 general support general support for products can be found at bluetechnix support site https://support.bluetechnix.at/wiki 7.2 b oard support packages board support packages and software downloads are for registered custome rs only https://support.bluetechnix.at/software/ 7.3 blackfin ? software support 7.3.1 blacksheep? os blacksheep? os stands for a powerful ly and multithreaded real - time operating system (rtos) originally designed for digital signal processing application development on analog devices blackfin? embedded processors. this high - performance os is based on the reliable and stable real - time vdk ker nel from analog devices that comes with vdsp++ ide. of course blacksheep? os is fully supported by all bluetechnix core - modules and development hardware. 7.3.2 labview you can get labview embedded support for bluetechnix core modules by schmid - engineering ag http://www.schmid - engineering.ch . 7.3.3 uclinux you can get uclinux support ( boot loader and uclinux ) for bluetechnix c ore modules at http://blackfin.uclinux.org . 7.4 b lackfin ? design services based on more than seven years of experience with blackfin, bluetechnix offers development assistance as well as custom design services and software development. 7.4.1 upcoming products and software releases keep up to date with all prod uct changes , releases and software updates of bluetechnix at http://www.bluetechnix.com .
cm - bf537_hum_v3.2.docx 26 8 ordering information - - - - - - product family former name cm = core modul e special sbc = single board computer custom core modules or specials cpu-type uc = uclinux equals the name of cpu extra controllers mounted connection-type e = ethernet a = bga u = usb b = border pad flash [mb] c = connector f = nor flash [mb] s = speci al n = nand fl as h [mb] operating temperature range ram a = automoti ve s = sdram [mb] c = commerci al i = industry crystal frequency notati on: qxx[mhz] cm bf537 c c/i q25 f4 (CM-BF537e) s32/64 8.1 predefined mounting options for cm - bf537 article number name temperature range 100- 1221 - 3 cm - bf537 - c - c - q25s32f4 (cm - bf537e) commercial 100- 1229 - 3 cm - bf537 - c - i - q25s32f4 (cm - bf537e - i) industrial 100- 1273 - 3 cm - bf537 - c - c - q25s64f4 (cm - bf537e - 64sd) commercial table 8 - 1 : ordering information note: custom core modules are available on request ! please contact bluetechnix ( office@bluetechnix.com ) if you are interested in custom core modules. the mount options of the core module cm - bf537 are shown in table 8 - 2 . mount option flash comment mo1 2mb pf4 available on pin 7 on connector x1 mo2 4mb default mo3 8mb pf5 not available on connector x1 table 8 - 2 : mount o ptions
cm - bf537_hum_v3.2.docx 27 9 dependability 9.1 mtbf please keep in mind that a part stress analysis would be the only way to obtain significant failure rate results, because mtbf numbers just represent a statistical approximation of how long a set of devices should last before failure. nevertheless, we can calculate an mtbf of the core module using the bill of material. we take all the components into account. the pcb and sol der connections are excluded from this estimation. for test conditions we assume an ambient temperature of 30c of all core module components except the blackfin? processor (80c) and the memories (70c). we use the mtbf calculator from ald ( http://www.aldservice.com/ ) and use the reliability prediction mil - 217f2 part stress standard. this method resulted in a mtbf of 439232 hours for the cm - bf537e.
cm - bf537_hum_v3.2.docx 28 10 product history 10.1 version information 10.1.1 cm - bf537 - c- c- q25s32f4 (cm - bf537e) version component type 3.0.1 processor ram flash eth - physical adsp - bf537kbcz - 6av (rev 0.3) mt48lc16m16a2bg - 75it:d pf48f2000p0zbq0 ksz8041 3.0.2 processor ram flash eth - physical adsp - bf537kbcz - 6av (rev 0.3) is42s16160d - 7bl pf48f2000p0zbq0 ksz8041 3.0.3 processor ram flash eth - physical adsp - bf537kbcz - 6av (rev 0.3) is42s16160d - 7bl pf48f3000p0zbq0a ksz8041 3.2.1 processor ram flash eth - physical adsp - bf537kbcz - 6av (rev 0.3) mt48lc16m16a2bg - 75it:d pf48f3000p0zbqe ksz8041 table 10- 1 : overview cm - bf537 - c - c - q25s32f4 product changes 10.1.2 cm - bf537 - c- i - q25s32f4 (cm - bf537e - i) version component type 3.0.1 processor ram flash eth - physical adsp - bf537bbcz - 5a (rev 0.2) mt48lc16m16a2bg - 75it:d pf48f2000p0zbq0 ksz8041 3.0.2 processor ram flash eth - physical adsp - bf537bbcz - 5 a (rev 0.3) mt48lc16m16a2bg - 75it:d pf48f2000p0zbq0 ksz8041 3.2.1 processor ram flash eth - physical adsp - bf537bbcz - 5 a (rev 0.3) mt48lc16m16a2bg - 75it:d pf48f3000p0zbq e ksz8041 table 10- 2 : overview cm - bf537 - c - i - q25s32f4 product changes 10.1.3 cm - bf537 - c- c- q25s64f4 (cm - bf537e - 64sd) version component type 3.2.1 processor ram flash adsp - bf537kbcz - 6av (rev 0.3) is42s16320b - 7bl pf48f3000p0zbqe ksz8041 table 10- 3 : overview cm - bf537 - c - c - q25s64f4 product changes
cm - bf537_hum_v3.2.docx 29 10.2 anomalies version date description 3.2 2011 04 27 no anomalies reported yet. 3 .0 2010 10 12 no anomalies reported yet. table 10- 4 : overview product anomalies
cm - bf537_hum_v3.2.docx 30 11 document revision history version date document revision 9 2012 05 24 description of pin 78 and pin 5 of core module corrected 8 2012 02 07 dependability added memory table update , description for pf5 added 7 2011 11 14 pin out and connector description corrected 6 2011 10 18 table 3 - 1 : electrical characteristics update 5 2011 09 06 pin out and connector description corrected 4 2011 04 27 updated hum to current design. added industrial version and 64mbyte version to this hum. 3 2010- 02- 02 redesign of manual 2 2009- 11- 05 picture 3 - 7, 6 - 1, 6 - 2, table 6 - 1, 6 - 2 updated 1 2009- 08- 31 first release v1.0 of the document copied from cm - bf537 v1.2 and updated to revision 3.0 table 11- 1 : revision h istory
cm - bf537_hum_v3.2.docx 31 12 list of abbreviations abbreviation description adi analog devices inc. ai analog input ams asynchronous memory select ao analog output cm core module dc direct current dsp digital signal processor ecm enhanced core module ebi external bus interface esd electrostatic discharge gpio general purpose input output i input i2c inter - integrated circuit i/o input/output ism image sensor module ldo low drop - out regulator mtbf mean time between failure nc not connected nfc nand flash controller o output os operating system ppi parallel peripheral interface pwr power rtos real - time operating system rfu reserved for future use sada stand alone debug agent sd secure digital soc system on chip spi serial peripheral interface spm speech processing module sport serial port tft thin - film transistor tism tiny image sensor module tsc touch screen controller uart universal asynchronous receiver transmitter usb universal serial bus usbotg usb on the go zif zero insertion force table 12- 1 : list of abbreviations
cm - bf537_hum_v3.2.docx 32 a list of figures and tables figures figure 1 - 1: main components of the cm - bf537 core module ............................................................................................................... 8 figure 2 - 1: detailed block diagram ................................................................................................................................................................ 10 figure 2 - 2: assenbly drowing top view ........................................................................................................................................................ 11 figure 5 - 1: schematic of reset circuit on the core module .................................................................................................................. 18 figure 5 - 2: schematic for rj45 connection ................................................................................................................................................ 19 figure 5 - 3: configuration with ethernet and jtag connector ........................................................................................................... 20 figure 5 - 4: stand - alone ethernet based m peg webcam ....................................................................................................................... 21 figure 6 - 1: mechanical outline (top view) ................................................................................................................................................... 22 figure 6 - 2: mechanical outline and bottom connectors (top view) ................................................................................................ 23 figure 6 - 3: side view with mounted connectors ...................................................................................................................................... 23 figure 6 - 4: recommended footprint for the core module (top view) ............................................................................................. 24 tables table 2 - 1: memory map ...................................................................................................................................................................................... 11 table 2 - 2: externally addressable memory ................................................................................................................................................. 12 table 3 - 1: electrical characteristics ................................................................................................................................................................ 13 table 3 - 2: absolute maximum ratings .......................................................................................................................................................... 13 table 4 - 1: connector description x1 ............................................................................................................................................................. 16 table 4 - 2: connector description x2 ............................................................................................................................................................. 17 table 5 - 1: parts list rj45 .................................................................................................................................................................................... 19 table 5 - 2: bill of material of sample circuit ................................................................................................................................................. 20 table 5 - 3: bill of materials of a stand - alone ethernet based mpeg webcam ............................................................................... 21 table 6 - 1: core module connector types ..................................................................................................................................................... 24 table 8 - 1: ordering information ..................................................................................................................................................................... 26 table 8 - 2: mount options ................................................................................................................................................................................... 26 table 10 - 1: overview cm - bf537 - c - c - q25s32f4 product changes ................................................................................................... 28 table 10 - 2: overview cm - bf537 - c - i - q25s32f4 product changes .................................................................................................... 28 table 10 - 3: overview cm - bf537 - c - c - q25s64f4 product changes ................................................................................................... 28 table 10 - 4: overview product anomalies .................................................................................................................................................... 29 table 11 - 1: revision history .............................................................................................................................................................................. 30 tabl e 12- 1: list of abbreviations ..................................................................................................................................................................... 31

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